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端侧AI扩大DRAM超级周期，半导体需求从HBM继续外溢
发布: · 来源: hankyung.com
一句$话总结: 《韩国经济新闻》称，AI服务器和端侧AI扩散正在推高HBM以及GDDR7、LPDDR5等DRAM需求，半导体超级周期预期升温。
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《韩国经济新闻》报道称，人工智能投资正从服务器扩展到用于智能手机、PC和自动驾驶汽车的端侧AI，市场对以DRAM为中心的半导体超级周期的期待正在升温。AI服务器所需的HBM需求率先带动景气，GDDR7、LPDDR5等通用DRAM以及SSD需求也在增加。摩根士丹利认为，存储周期可能延续至2027年；全球HBM市场预计将从2023年的30亿美元扩大到2027年的530亿美元。TechInsights预计，DRAM市场可能从2024年的980亿美元增至2030年的2200亿美元。不过，CXMT进入先进DRAM、HBM可能供过于求以及美国半导体关税被列为变量。来源: hankyung.com
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